13 meilleures offres (packaging engineer, ottawa, on) (à pourvoir)

Microelectronic Packaging Design Engineer
Sanmina Corporation —Ottawa, ON
- De 110 000 $ à 140 000 $ par an
- Ingénierie
- Baccalauréat
- Diplôme universitaire non requis
Advanced Packaging Engineer - SI/PI
Marvell —Ottawa, ON
- De 86 300 $ à 115 000 $ par an
- Temps plein
- Doctorat
- Ingénierie
- Maîtrise
Staff Mechanical Design Engineer
Viavi Solutions —Ottawa, ON
- De 91 842 $ à 170 564 $ par an
- Temps plein
- CAD
- Ingénierie
- Maîtrise
- Assurance Invalidité
- Congés payés
Mechanical Design Engineer
Sanmina Corporation —Ottawa, ON
- De 100 000 $ à 150 000 $ par an
- AutoCAD
- Ingénierie
- Assemblage
Senior RF/EM Design Engineer
Skyworks Solutions —Ottawa, ON
- De 105 160 $ à 136 785 $ par an
- Doctorat
- CAD
- Expérience en laboratoire
- Plan d'actionnariat des employés
- Congés payés
Senior Si Photonics Design Engineer - Optical Solutions
Molex —Nepean, ON
- De 150 000 $ à 225 000 $ par an
- Doctorat
- Ingénierie
- Maîtrise
Optomechanical Design Engineer
Q-Block Computing —Ottawa, ON
- De 75 000 $ à 145 000 $ par an
- Temps plein
- CAD
- Ingénierie
- Conception de systèmes
- Assurance Dentaire
- Assurance Vision
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High Speed PCB Senior Staff Layout Designer (RF / Optics)
Marvell —Ottawa, ON
- De 115 700 $ à 154 300 $ par an
- Temps plein
- CAD
- Ingénierie
- Baccalauréat
Mixed-Signal Design Developer
Cisco Systems —Kanata, ON
- De 159 000 $ à 350 800 $ par an
- Temps plein
- Travail hybride
- Doctorat
- Vente
- Expérience en laboratoire
- Jours fériés payés
- Assurance Invalidité
High Speed PCB Layout Designer (RF / Optics)
Marvell —Ottawa, ON
- De 95 700 $ à 127 600 $ par an
- Temps plein
- CAD
- Ingénierie
- Baccalauréat
PCB Designer
ORBCOMM —Ottawa, ON
- De 80 000 $ à 100 000 $ par an
- Temps plein
- AutoCAD
- Schémas
- Ingénierie
- Congés payés
Postuler rapidement
Analog/mixed-signal IC Design Developer - Acacia - (Hybrid)
Cisco Systems —Kanata, ON
- De 142 000 $ à 277 400 $ par an
- Temps plein
- Travail hybride
- Doctorat
- Vente
- Expérience en laboratoire
- Jours fériés payés
- Assurance Invalidité
Analog/Mixed-signal Sustaining IC Design Developer - Acacia (Hybrid)
Cisco Systems —Kanata, ON
- De 142 000 $ à 277 400 $ par an
- Temps plein
- Travail hybride
- Doctorat
- Vente
- Expérience en laboratoire
- Jours fériés payés
- Assurance Invalidité

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Advanced Packaging Engineer - SI/PI
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1324b(a)(3), all applicants may be subject to an export license review process prior to employment. Bonus: Experience with 2.5D/3D package development, MATLAB‑…
De 86 300 $ à 115 000 $ par an
Senior Si Photonics Design Engineer - Optical Solutions
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Reporting to the Manager of Si Photonics (SiPho) Component Design, you will be a key member of the team and will contribute to various aspects of PIC…
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Electrical Controls Design Engineer
COUSINS PACKAGING INC. —Mississauga, ON
PLC and Operator Interface program development. _Related keywords: electrical engineer, electrical, engineer, electrical engineering, electrical drafter_.
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Je souhaite recevoir la dernière alerte emploi pour les postes de ce type : packaging engineer (ottawa, on)

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Microelectronic Packaging Design Engineer

Sanmina Corporation
Ottawa, ON

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Détails du poste

Compétences

Génie mécanique
Ingénierie
Ingénierie mécanique
Baccalauréat
Développement de produit
Physique
Production
Compétences en communication

Description complète du poste

Advanced Microsystems Technologies, AMT, is a technology division of Sanmina Corporation (Nasdaq: SANM), responsible for RF, Microelectronic, Optical components and Integrated Subsystems, providing services from design concept, through prototype design and testing, process development, assembly and test innovation, to volume manufacturing. We are extremely proud to partner with our customers enabling their product through the full product lifecycle.

At AMT, you will work on some of the most innovative programs and products that address emerging markets, including optical and RF communication, datacenter connectivity, quantum computing, automotive sensing systems, medical devices and diagnostics and test & measurement systems, to name a few.

Come and join us, and be part of a team that challenges you to be your best, where you will be empowered to make a difference and where we are extremely proud of what we deliver, together.

Job Purpose

The Microelectronic Design Engineering team, as part of Sanmina’s Global Design Engineering Team, represents one of the key strategic growth areas of the total engineering service offering. Our team provides engineering and design services in microelectronic, optical and semiconductor packaging and component design supported through its in depth background in materials technology, thermal, structural and reliability engineering.

We are seeking a Microelectronic Packaging Design Engineer to join our team and support both technology and product development programs, from initial technology selection and concept definition through detailed design, prototyping, qualification and volume manufacturing phases.

Nature of Duties/Responsibilities:

Select microelectronic technologies and definition of design concepts, based on product applications, requirements and specifications.
Design microelectronic packages & modules, including integrating elements of material selections, substrate layout and designs, mechanical, thermal as well as incorporating key aspects of reliability, electrical (RF), optical, test and process engineering for volume manufacturing.
Contribute to microelectronic design and engineering activities as part of a multidisciplinary product development team including electrical/RF engineering optical engineering, reliability engineering, layout, documentation, manufacturing/process engineering and test engineering, in line with customer requirements and specifications.
Generate product documentation including design specifications, drawings (piece parts, assembly, process) Bill of Materials, documentation release by engineering change order (ECO).
Define specifications/requirements and coordinate/interface with manufacturers/suppliers for outsourced custom components.
Perform and support engineering product verification, ensuring compliance to product requirements.
Support business development initiatives including interfacing with potential and existing customer, preparation of marketing materials, proposals and quotations.
Support turnkey product development process through to manufacturing implementation.

Education and Experience:

Bachelor’s Degree in Mechanical Engineering, Physics, Material Science, or other relevant degree with experience in electronic hardware design and packaging including multi-chip modules and semiconductor packaging for RF/Microwave/Optical applications.
Minimum of 8 years’ of relevant experience.
Proficient with packaging and substrate design software (Cadence Allegro Package Designer Plus).
Background or relevant experience in microelectronic technologies, materials, components, manufacturing methods.
Experience in end-to-end product development and manufacturing implementation.
Familiar with commercial FEA tools and supporting analysis.
Security clearance is an asset.
Must be customer delivery focused, have strong communication skills, and be able to work well within a multidisciplinary product development team in a fast-paced and challenging environment.

OTHER INFORMATION

The compensation range for this position is $110,000- $140,000 annually.
This position is for an existing vacancy.
The hiring process for this position does not use Artificial Intelligence (AI).

Sanmina welcomes and encourages applications from persons with disabilities. In accordance with the guidelines established under the Accessibility for Ontarians with Disabilities Act (AODA), accommodations are available on request for candidates taking part in all aspects of the selection process.

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Je souhaite recevoir la dernière alerte emploi pour les postes de ce type : packaging engineer (ottawa, on)

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