Position Summary
SwiftLink Technologies develops high-frequency wireless infrastructure, RFIC products, advanced packaging architectures, and integrated antenna systems for next-generation communication networks, including beamforming, millimeter-wave, and silicon photonics technologies.
The Engineering Manager, Application and Product Test, will lead the team responsible for post-silicon validation, characterization, production testing, and field application engineering across SwiftLink’s RFIC, Antenna-in-Package (AiP), and antenna array portfolios. This is a hybrid leadership role that combines deep technical expertise in microwave and millimeter-wave engineering with the management of complex test methodologies and customer-facing engineering initiatives. The successful candidate will work closely with the design, packaging, and business development teams to bring complex silicon from first tapeout to high-volume commercial deployment.
Key Responsibilities
1. Team Leadership and Strategy
- Lead, mentor, and grow a specialized team of RF application engineers, test automation engineers, and hardware validation professionals.
- Define the roadmaps for post-silicon characterization, automated test equipment (ATE) strategy, and customer reference design platforms.
- Manage laboratory resources, equipment procurement, capital expenditure (CapEx) budgeting, and vendor relationships for specialized high-frequency testing services.
2. Test Engineering and Silicon Validation
- Oversee the creation and execution of test requirement documents (TRDs) and compliance matrices for advanced RFICs, including wideband transceivers and phased-array beamformers operating across the X, Ku, Ka, and 60 GHz bands.
- Drive the strategy for DC operating parameters, high-order modulation testing, transient output analysis, and phase noise measurements.
- Guide the deployment of production-level high-frequency packaging and test solutions, coordinating with international manufacturing partners and OSATs to ensure yield optimization and cost-effective test coverage.
3. Advanced Packaging and Hardware Application Engineering
- Collaborate with the IC design and packaging architects to validate next-generation integration schemes, including Silicon-on-Insulator (SOI) CMOS and Antenna-in-Package (AiP).
- Oversee the development of evaluation boards, reference designs, and production-ready AiP modules to support customer adoption.
- Act as the technical escalation point for tier-1 telecommunications and infrastructure clients, ensuring smooth integration of SwiftLink technology into their systems.
Required Qualifications and Technical Skills
Education and Experience
- Bachelor’s or Master’s degree in Electrical Engineering, Engineering Physics, or a closely related field with an emphasis on RF/microwave systems; a PhD is an asset.
- 8+ years of hands-on experience in RFIC validation, application engineering, or product test engineering, including at least 3 years in an engineering leadership or management role.
Technical Skills
- RF/Microwave Expertise: Strong understanding of millimeter-wave concepts, phase weight calculations for antenna arrays, active beamforming architectures, and S-parameter verification.
- Instrumentation: Proven experience designing test benches using vector network analyzers (VNAs), spectrum analyzers, signal generators, high-speed oscilloscopes, and load-pull systems.
- Packaging: Familiarity with the thermal, signal integrity, and test challenges of advanced semiconductor packaging, including Flip-Chip, AiP, SOI, and optical/electrical co-packaging.
- Automation and Software: Proficiency in test automation frameworks such as Python, LabVIEW, or MATLAB for data collection and statistical analysis.
Leadership and Soft Skills
- Communication: Ability to translate complex RF and optical performance data into clear, actionable summaries and technical documentation for executives and clients.
- Cross-Functional Collaboration: Track record of working effectively across disciplines, connecting design engineers, external foundries, OSATs, and customer product managers.
- Adaptability: Comfortable in a startup environment, able to move between hands-on laboratory testing and higher-level project management.
What We Offer
- Competitive salary, performance bonuses, and equity options.
- Comprehensive health, dental, and wellness benefits.
- The opportunity to help shape the core technology behind the next generation of wireless infrastructure.
- A collaborative, innovation-focused workplace in Richmond, BC or Ottawa’s Kanata technology hub.
Pay: $100,000.00-$120,000.00 per year
Benefits:
- Dental care
- Employee stock purchase plan
- Extended health care
- On-site parking
- Vision care
Work Location: In person
