Company Description
Quantum Recon is a pioneering company at the forefront of quantum computing innovation. With a skilled team of scientists, engineers, and developers, we focus on addressing noise and packing density challenges for quantum computing systems. Our cutting-edge quantum photonic I/O system offers superior performance and cost efficiency, aiming to transform quantum computing into a practical and scalable technology. We are committed to driving progress in the quantum landscape, building solutions that facilitate quantum advantage for businesses and research institutions worldwide.
Currently, quantum processors suffer from an I/O bottleneck caused by coaxial wiring, which introduces heat, consumes cryostat space, and increases system complexity and cost. Our photonic I/O solution directly addresses this by reducing cryogenic power dissipation, increasing bandwidth and reliability, and lowering the system's footprint. By fundamentally decoupling the cost and heat of I/O from the qubit count, our ultimate goal is to enable control and readout architectures capable of scaling to the millions of qubits required for achieving error-corrected, fault-tolerant quantum computation.
Role Description
We are seeking a Cryogenic Photonics and Packaging Engineer for a full-time, on-site position in the Greater Vancouver Metropolitan Area. In this role, you will lead the development of photonic devices and packaging solutions optimized for operation at cryogenic temperatures, working closely with a focused team of technical staff, including experts in photonic integrated circuits and quantum applications. Your role will involve:
- Designing and optimizing cryogenic-compatible photonic and optoelectronic subsystems, including optical-microwave conversion modules
- Developing low-loss optical coupling strategies (e.g., photonic wirebonding, cryogenic lens systems)
- Engineering RF-aware packaging architectures, ensuring impedance matching, bandwidth preservation, and low noise
- Performing thermal and mechanical analysis of packaged systems in dilution refrigerators
- Leading experimental validation at room and cryogenic temperatures (optical and microwave)
- Contributing to system-level architecture design, including scaling multiplexers and channel density optimization
- Contributing to technical strategy, application definition, and intellectual property development
Qualifications
- Strong expertise in cryogenic systems and/or photonic packaging
- Proven ability to drive Research and Development (R&D) initiatives in engineering and technology
- Experience with RF/microwave design considerations in integrated systems
- Familiarity with optical coupling techniques and fiber-chip interfaces
- Experience with simulation tools (COMSOL, Lumerical, or similar)
- Strong experimental skills in device characterization and system integration
- Strong problem-solving skills and ability to work collaboratively in an interdisciplinary team
- Experience with CAD software and other design tools relevant to packaging
- MSc or PhD in Electrical Engineering, Applied Physics, Photonics, or related field
- Industry or postdoctoral experience will be considered for senior roles
Compensation
The salary range for this position is $70,000-$130,000, depending on qualifications, experience, and level of responsibility. Candidates with postdoctoral or relevant industry experience may be considered for higher compensation within this range.
A Note on Qualifications
We know that no candidate will tick every box perfectly - and we value potential, creativity, and diverse experiences over a perfect checklist. If you’re excited about our photonic interconnect technology and feel that you bring many, even if not all, of the qualifications, we encourage you to apply. Contact: [email protected].
Pay: $70,000.00-$130,000.00 per year
Benefits:
- Dental care
- Employee stock purchase plan
- On-site parking
- Stock options
Work Location: In person
